About the role

The Molding Process Development Staff/Principal Engineer is responsible for leading the development, optimization, and qualification of epoxy molding processes for advanced semiconductor packages. This role plays a critical part in ensuring high-yield, robust, and cost-effective molding solutions for new product introductions (NPI), package technology platforms, and manufacturing ramp-up activities.

What you will do:

Drive the development and qualification of molding processes for a wide range of packages (QFN, DFN, BGA, HVQFN, SiP, power packages, Fan-Out).

Define molding design rules, material selection criteria, process parameters, and tooling strategies to meet package reliability, warpage, and cosmetic performance targets.

Lead molding trials, DOE studies, and process characterizations using structured problem-solving and statistical methods (e.g., Cp/Cpk, FMEA, SPC).

Evaluate and select molding compounds, mold tooling (e.g., chase blocks, inserts), and equipment (e.g., Towa, ASM, Hanmi, Accretech).

Work with R&D, NPI, product design, and reliability teams to align molding strategies with overall package architecture.

Troubleshoot and mitigate molding-related defects such as delamination, voids, resin bleed-out, wire sweep, and package warpage.

Develop and maintain technical documentation: control plans, process specifications, SOPs, technical reports, and FMEAs.

Support smooth technology transfer and ramp-up to high-volume manufacturing or OSAT partners.

Interface with materials suppliers and equipment vendors to stay up to date on the latest innovations in molding technology.

Contribute to the process technology roadmap for advanced packaging, thin packages, and emerging device architectures.

What you will need:

Bachelor’s or Master’s Degree in Mechanical Engineering, Materials Science, Polymer Engineering, or a related field.

Minimum 8+ years of experience in semiconductor backend process development, with at least 5 years in epoxy molding.

Strong hands-on experience with compression and transfer molding processes, including thin mold, exposed pad molding, and multi-die molding.

In-depth knowledge of mold compound properties, material flow behavior, curing characteristics, and interaction with other assembly materials (e.g., die attach, wire bond).

Skilled in process characterization tools and methodologies (e.g., DMA, TGA, X-ray, SEM, DSC, warpage metrology).

Proficiency with statistical tools (e.g., JMP, Minitab) and engineering documentation.

Demonstrated ability to lead cross-functional teams and manage multiple development projects independently.