Job description:

Sustains and optimizes test and inspection processes and equipment to ensure continuous improvement, issue resolution, maximum tool productivity, and new product qualification.
Sustains and optimizes front-end test and inspection processes through advanced optical surface analysis, wafer geometry evaluation, profilometry, spectrophotometry, ellipsometry, PL measurement and defect characterization for Wafer Probing, Auto Vision Inspection (AVI) and ultrasound inspection.
Leads FMEA risk assessments to establish process controls, develops Engineering Control Plans, OCAPs and Work Instructions, and applies SPC methodologies to ensure process capability (Cp, Cpk).
Collaborates with PI, FPD, and NPI engineers to understand product integration, establish Line of Defense (LoD), and ensure process stability within defined process windows.
Drives continuous improvement initiatives to enhance tool uptime and efficiency, reduce costs, and improve quality and yield. Collaborates with RBG counterparts to synchronize process changes across sites and promote technical knowledge sharing.
Performs N+1 tool qualification and EPA release activities to support production ramp milestones. Develops new equipment purchase specifications in alignment with the Global Equipment Strategy roadmap and drives tool design improvements.
Establishes control measures to ensure conformance to ISO/TS 16949, ISO 45001, ISO 14001, and other standards, while leading customer and certifying body audits.


Profile description:

Degree / Master in Electrical & Electronics / Mechatronic / Mechanical / Chemical Engineering.
Min 7 years experience in manufacturing environment & min 3 years experience in probing process engineering.
Good in test & Inspect skills, problem solving, presentation and communication skills.
Fluency in English and Bahasa Malaysia.