Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .

Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).

Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.

Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.

Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67

Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.

Attend MRB for non-conformance lot disposition and follow up on 8D topic.



Requirements:

Bachelor degree or above in Engineering.

Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD as an added advantage.

Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.

Knowledge of problem solving skill, 6Sigma DMAIC approach.

Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.

Good communication skill in English and Bahasa Malaysia.