Process Engineer - Wirebond / Die Attach

Job Description (Wire Bond)

1) Basic machine setup for K&S Iconn Plus/ Rapid wire bonder with existing program recipe available in the machine.

2) Change wire and capillary after tool limit and perform SPC buyoff to ensure machine running smooth.

3) Perform basic machine troble shooting related to wire bond process.

4) Monitor machine performance and to ensure machine running smooth with good quality output.

5) Prepare daily/weekly yield report and defect pareto in excel and power point file.

6) Perform defect analysis to identify possible root cause and provide corrective/preventive action.

7) Provide support on any tasks assigned by immediate supervisor or engineer.



Job Description (Die Attach)

1) Basic machine setup for Datacon 2200 Evo Plus with existing program recipe available in the machine.

2) Change and setup ejector needle, perform calibration to ensure no risk of die crack and die pickup problem.

3) Perform epoxy stamping parameter adjustment to achieve correct epoxy coverage wthin spec requirement.

4) Perform die placement parameter adjustment to achieve correct die placement within the spec requirement.

5) Perform basic machine troble shooting related to die attach process.

6) Monitor machine performance and to ensure machine running smooth with good quality output.

7) Prepare daily/weekly yield report and defect pareto in excel and power point file.

8) Perform defect analysis to identify possible root cause and provide corrective/preventive action.

9) Provide support on any tasks assigned by immediate supervisor or engineer.

Requirement:

Engineer - Masters/Bachelor's Degree in Mechatronic/Electrical/Electronics/Materials/Mechanical Engineering and have experience minimum 2 years.