Process Engineer (Sawing/Dicing/Laser Grooving)

Position: Process Engineer
Industry: Semiconductor Manufacturing
Location: Bayan Lepas, Penang

We are looking for a Process Engineer with experience in Dicing, Sawing, and/or Laser Grooving processes to join our semiconductor manufacturing team. The successful candidate will be responsible for process optimization, troubleshooting, yield improvement, and ensuring stable production performance.

Key Responsibilities:

Manage and improve semiconductor dicing/sawing/laser grooving processes to achieve production targets.
Perform process monitoring, troubleshooting, and root cause analysis for process issues.
Drive process improvement activities to enhance yield, quality, and productivity.
Support new product introduction (NPI), process qualification, and equipment setup.
Analyze process data and implement corrective/preventive actions (CAPA).
Work closely with Production, Equipment, Quality, and Engineering teams.
Prepare process documentation, reports, and technical analysis.

Requirements:

Degree in Engineering (Electrical / Electronics / Mechanical / Semiconductor / related field).
Experience in semiconductor wafer manufacturing is preferred.
Hands-on experience in Dicing Saw, Wafer Sawing, Laser Grooving, or related wafer processing is highly preferred.
Knowledge in wafer handling, process control, SPC, DOE, and yield improvement.
Strong troubleshooting and analytical skills.
Able to work independently and support production requirements.

Preferred Experience:

Semiconductor back-end process experience.
Experience with wafer saw machines, blade selection, cutting parameters, or laser process optimization.
Familiar with semiconductor quality systems and manufacturing environment.

Why Join Us:

Opportunity to work in advanced semiconductor manufacturing technology.
Exposure to process improvement and engineering projects.
Competitive benefits and career growth opportunities.

Apply Now:
Send your updated resume to us.