Associate Engineer

1. Equipment Associate Engineer (EAE) - Die Preparation / Recon • Carrier Lamination
• Pick & Place
• Wafer Saw
• Wafer Backgrind
• Laser Grooving
• Wafer Mounting
• Taping & Detaping
• Moudling

2. Process Associate Engineer (PAE) - Die Preparation
• Backgrind
• Dicing
• Laser Grooving

3. Process Associate Engineer (PAE) - Molding
• Molding
• De-bonding

4. Process Associate Engineer (PAE) - Pick and Place
• Die Pick & Place

5. Logistic Assistant
• Can offer WP
• Must have Singapore forklift license •
6 months contract (renewable)

6. QA Associate Engineer (QAAE)
• Chinese only
• Must have relevant QA Engineer Experience in Semiconductor.